Silicon Run II

This sequel to Silicon Run reviews IC fabrication and continues through testing, packaging, and assembly, including PC board design, component placement, and soldering. It also discusses computer structure, signal integrity, and multichip technology.

1. Introduction (1:55)
2. Review (4:55) transistors, logic gates, design, IC fabrication
3. Testing and Packaging (6:33) wafer test, wafer saw, die attach, wire bonding, encapsulation, metal plating
4. IC Devices (2:19) burn-in, electrical test, sort, logo marking
5. Circuit Board Assembly (5:27) design, solder screen print, pick and place, re-flow, double-sided surface mount, through-hole assembly, rivet press, wave solder, board test
6. System Assembly (1:24) board-in casing, speaker assembly, disk drive and cables, floppy drive, power supply, system test
7. Computer Architecture (4:11) system software, computer structure, signal integrity
8. Multichip Technology (7:13) high-end planar module, multichip unit board, TAB bonding, MCU assembly, pin fin (for cooling)

Maintained by John Loomis, last updated 23 April 2015