MEMS – Making Micro Machines

  1. Introduction to MEMS (4:40)

    Microfluidics

  2. Inkjet Printheads (2:15) fabrication process, printhead compartments, integrated device, material selection
  3. Building the thermal resistor (5:29) silicon dioxide deposition, metal deposition, photolithography patterning, metal etch, resistor metal patterning, deposition of protective layers
  4. Building the chamber walls (2:39) depostion of barrier material, patterning of barrier material, spray develop, chamber pillars, sacrifical wax
  5. Creating the nozzles (3:51) dry film application, patterning nozzle material, laser & bulk etch, wafer saw, visual inspection

    Optical MEMS

  6. Digital mirror devices (2:51) structure overview, DMD layers, temporary spacers, hinge & posts, yoke element, post and mirror
  7. Packaging: DMD Chips (4:05) removal of spacers, bonding window to wafer, singulation, expoxy dispense and placement, wire bonding, electrical test, encapsulation
  8. Tests (2:55) burn-in test, overcoming striction, tilt test, angle test, visual test

    Sensors

  9. MEMS Design Process (4:18) team effort, pressure & inertial sensors, design flow chart, customer requirements, microsystem scoping
  10. Design Team (6:07) Mechanical designer, ASIC designer, System engineer, System-in-package, stack formation, partitioning & model generation, transducer & package model, ASIC block, Microsystem analysis, Bosch process, microsystem verification


Maintained by John Loomis, last updated 23 April 2015