MEMS – Making Micro Machines
- Introduction to MEMS (4:40)
Microfluidics
- Inkjet Printheads (2:15)
fabrication process, printhead compartments, integrated device, material selection
- Building the thermal resistor (5:29)
silicon dioxide deposition, metal deposition, photolithography patterning, metal etch,
resistor metal patterning, deposition of protective layers
- Building the chamber walls (2:39)
depostion of barrier material, patterning of barrier material, spray develop, chamber pillars,
sacrifical wax
- Creating the nozzles (3:51)
dry film application, patterning nozzle material, laser & bulk etch, wafer saw,
visual inspection
Optical MEMS
- Digital mirror devices (2:51)
structure overview, DMD layers, temporary spacers, hinge & posts, yoke element,
post and mirror
- Packaging: DMD Chips (4:05)
removal of spacers, bonding window to wafer, singulation, expoxy dispense and placement,
wire bonding, electrical test, encapsulation
- Tests (2:55)
burn-in test, overcoming striction, tilt test, angle test, visual test
Sensors
- MEMS Design Process (4:18)
team effort, pressure & inertial sensors, design flow chart, customer requirements,
microsystem scoping
- Design Team (6:07)
Mechanical designer, ASIC designer, System engineer, System-in-package, stack formation,
partitioning & model generation, transducer & package model, ASIC block, Microsystem analysis,
Bosch process, microsystem verification
Maintained by John Loomis,
last updated 23 April 2015